CAM350 V9.1介绍及CAM350下载

DownStream公司宣布CAM350的V9.1版本发布,对于国内的用户而言,大部分用的是CAM350 V8.0,还有不少还在用CAM350 V7和V6版本是,就是在国内的代理比思公司而言,官方介绍的,还是在V8版本.

在DownStream的官方版本上,我们可以看到,最新的版本是CAM350 V9.12,在以下这个页面,大家可以填写一下自己的资料,然后得出官方给出的CAM350 V9.12下载测试版:

https://www.downstreamtech.com/CAM350/CAMvu-form.html

以下是来自于官方的CAM350 V9.1的说明:
Marlborough, Mass – February 21, 2006 – DownStream Technologies, LLC today announced CAM350™ Release 9.1, the latest version of its industry-leading solution for the verification and optimization of printed circuit boards. In CAM350 V 9.1, Streams Rule Check is now included at no additional charge in the mid-level CAM350 configurations. This release also enhances the interfaces to major CAD systems including Mentor, Cadence and AutoCAD, as well as other updates.

Streams Rule Check, first introduced in the summer of 2005 by DownStream, is an entirely new method of performing PCB design analysis. It allows Design Rule checks, Design for Manufacturing checks and Netlist Comparison checks to be run simultaneously — or all in one “stream” — dramatically shortening the time it takes to analyze a design. It also allows a designer to save the stream based on technology, manufacturing capabilities or other requirements and recall it for use on future designs. The company will also be delivering this functionality to many customers under maintenance with DownStream as part of the Release 9.1 update.

“Verifying that PCB design data is ready for fabrication is often a tedious and time-consuming task that requires difficult setup,” said Rick Almeida, Founder of DownStream Technologies. “With Streams Rule Check, a designer can set-up once and execute a variety of analysis at one time, saving time and increasing productivity. With CAM350 V 9.1, we are making this very important functionality available to more of our customers by including it at no charge in our mid-level bundle,” he added.

Other Enhancements Included in CAM350 Release 9.1

New DFF Analysis Checks

New Negative Plane Analysis
 Plated Drill to Copper
 Unplated Drill to Copper
 Thermal Annular Ring
 Copper to True Board Edge
 Thermal Tie Width
 Plane Separator Minimum Width
                
* Copper to True Board Edge (Positive and Negative Layers)
* Find Antennas (Non-Terminating Traces)
* Missing Soldermask Clearance
* Silkscreen Minimum Line Width
* Enhanced Silk to Solder Analysis (10x performance increase)

Interface Updates

* Mentor PADS PCB 2005 SP2
* Cadence Allegro 15.51
* OrCAD 10.51
* Altium PCAD 2004 SP2
* AutoCAD DXF updates
* Adobe PDF compatibility updates

Soldermask Analysis Enhancements

* Now looks for missing soldermask clearances for all pads
* User can filter pads out if they are intended to be covered

Enhancements to Minimum Space and Minimum Width Analysis

* User requested enhancements to these 2 DFF Analyses