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Symbion™ P36 Plus Solder Paste AOI System

来源:Orbotech Ltd 作者: 发布时间:2007-07-11 发表评论

Better in Every Dimension

With superior POP detection technology, ultra fast speed, Wizard & Go operation and closed loop quality control tools, Symbion P36 Plus enables you to achieve incomparable yields and throughput while reducing your manufacturing costs.

Download Symbion™ P36 Plus Solder Paste AOI System datesheet

Symbion P36 Plus

 
Superior POP™ Detection Technology

  • 100% coverage for volume inspection and measurement
  • Simultaneous 3-D and 2-D inspection channels for height and area
  • Optimized high-resolution scanning technique
  • Intelligent, flexible component-specific analysis
  • Automatic board warpage compensation
  • Less than 10% Gage R&R

Ultra Fast Inspection Speed

  • Scan speed up to 60 cm2 /sec
  • High-speed image capture and analysis 
  • Streamlined architecture 
  • Minimal user interaction, no extra attention needed
  • Rapid board load/unload

Closed Loop Quality

  • Advanced defect monitoring and verification
  • Built-in SPC tools
  • Connected ADVISOR™ process control software
  • Data sharing with paste printer

Easy Wizard & Go™ Operation

  • Wizard-based graphical user interface
  • Short and easy training
  • Consistent and fast programming
  • Full off-line programming for maximized machine utilization
  • Compatibility with all common board types, materials and data formats
  • Smooth implementation into any environment

Unique POP™ Detection Technology

Unlike other paste inspection solutions that have to compromise on either speed or resolution, Symbion P36 Plus' patented POP technology employs a revolutionary approach to inspection that achieves the very highest resolution at or above line speed. POP utilizes an optimized scanning technique with two scan lines operating simultaneously via independent optical channels for 3-D and 2-D image acquisition. This enables 100% full board coverage and precise measurements of solder paste deposit volume, area, shape, and location.

 

 

Orbotech's unique 3-D laser triangulation method provides a clear, angled view for solder paste height mapping at the fine resolution of 5 µm. A true 2-D laser illumination channel ensures excellent top views of the solder paste at 20 x 20 µm resolution. The result is an exceptionally quick and complete picture of each solder paste deposit with virtually no false calls. Powerful image processing algorithms and techniques ensure highly accurate measurement, detection and classification.

For extra detection coverage on critical or challenging components or deposits, the system can be programmed to conduct intelligent BOM-linked solder paste analysis based on component and package-specific attributes with user-defined thresholds and inspection tolerances. To compensate for board warpage that can often be much greater than the solder paste deposit height, specially designed algorithms, optical techniques and hardware automatically adjust for an entire range of warpages (+3, - 6mm) during board scanning.

Symbion P36 Plus is a real measurement system with Gage R&R of less than 10% for typical process tolerances.

Ultra Fast Inspection Speed

The system is enhanced with streamlined architecture and powerful detection techniques for high throughput. It requires very little user interaction and has no need for constant attention, giving you maximum productivity. POP's optimized image acquisition and “on-the-fly” image processing quickly inspect the entire board. Wizard & Go makes programming and setup fast and efficient. With quick scan speeds of 22 cm2 /sec and an option for up to 60 cm2 /sec, Symbion P36 Plus keeps pace with your line speed today and is ready for when your throughput requirements increase.

Closed-Loop Quality

Symbion P36 Plus helps you close the loop on quality. Advanced defect monitoring and verification can be performed on-system, in-line or off-line using the integrated VeriFast21™ station. Symbion P36 Plus has built-in SPC tools as well as the ability to connect to Orbotech's comprehensive ADVISOR™ suite of process control software for tracking and analyzing solder paste defect data to improve process performance. The ability to share data with paste printers and other Orbotech AOI systems assures you can detect trends that might lead to defective boards and correct process parameters in real-time. This includes such challenging problems as: misregistration, blocked apertures, wrong squeegee speed or pressure, low height smears and unexpected paste deposits.

Easy Wizard & Go™ Operation

Symbion P36 Plus features Orbotech's innovative Wizard & Go operation for the ultimate in simplicity. With the 'point-and-click' workflow wizard, using the system is easy and training time is quick. The wizard guides you through each stage of program creation, giving you consistent performance. You can be ready for board inspection in less than ½ hour. Just Wizard & Go! Adjusting your program, verifying new settings and tracking your progress is effortless using Symbion's easy-to-follow graphic interface and tools. With full off-line programming capabilities, there is no need to use valuable machine time.

You can count on a smooth implementation into your SMT line with full SMEMA compatible, industry standard connectivity. A wide range of popular data formats can be quickly imported via a standard CAD reader so there is no need for third party tools. The system can also be easily configured for smooth connection to your shopfloor management system.

Symbion P36 Plus is an ideal solution for any production environment – fitting seamlessly into high-volume or high-mix lines. The system easily handles all board complexities, solder paste materials including lead-free and other difficult SMT applications.


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