EMI/EMC Simulation Software List（1）

11. SETH Corporation

Johnstown, PA

Phone: (814) 255-4417

Fax: (814) 255-3417

Software: EMIT

Description: This software combines method of moments (MOM) and finite difference time domain (FDTD) methods. It uses 2D and 3D models and incorporates a user friendly graphical interface. The Toolbox approach offers three calculating kernel applications and two graphical processors with a variety of supporting Tools.

12. Sigrity, Inc

Santa Clara, CA

Phone: (408) 260-9344

Software: SPEED2000

Description: SPEED2000 integrates circuit and transmission line simulations with a fast, special-purpose electromagnetic field solver that computes electromagnetic interactions in multi-layer chip packages and printed circuit boards. In SPEED2000, power and ground planes are not treated as ideal power and ground planes with fixed potentials. Electromagnetic interactions inside packages (such as package resonance, coupling between different components, as well as interactions between circuits and packages) are taken into account during simulations. Transient as well as spatial variations of voltages and currents on power and ground planes are all computed and can be easily visualized. Signal waveforms computed by SPEED2000 automatically contain the effects of power and ground voltage bounces. SPEED2000 is a versatile electrical simulation tool for the analysis and design of electronic packages including chip carriers and printed circuit boards. It is particularly effective to be used for, but not limited to, following applications: Computation of power and ground noise; Evaluation and design of power and ground distribution systems, including power and ground plane arrangement, and power and ground via/pin assignment; Determination of decoupling capacitor placement, including the number, values, and locations of decoupling capacitors; Identification of package resonance; Evaluation of electromagnetic coupling between different components; Evaluation of signal and noise waveforms at various locations; Evaluation of signal and noise spectrum at various locations; Determination of frequency-dependent port parameters of packages, such as port input impedances, S parameters, and transfer functions between different ports; Evaluation of electromagnetic radiation from packages and printed circuit boards.

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